CardWerk smarter card solutions

ISO 7816 Part 1: Physical Charcteristics of Integrated Circuit Cards

SmartCard API for .NET

Easy smart card integration with our smart card framework for .NET with C# and VB.NET sample code.

smart card API for C#

Sample code available for Mifare, DESFire, JavaCard, KVK, eGK, SIM, PIV, CAC, HID Prox/iCLASS and many more

Get SmartCard API NOW
download smart card API for C#, VB.NET and Visual Studio

ISO 7816 [part 1] [part 2] [part 3] [part 4]

This part describes the physical charcteristics of integrated circuit cards. It includes accomodation of exposure limits for a number of electromagnetic phenomena such as X-rays, UV light, elacromagnetic fields, static electrical fields, and ambient temperature of the card.

Furthermore, ISO7816-1 defines the characteristics of a card when it is bent or flexed. This is to make sure that plastic cards with embedded chips are manufactured in a way that guarantees flawless operation over the expected life time of a card. Connections beween the surface connectors and the I/O pins of the embedded silicon die must be maintaned and withstand mechanical stress. Bending and flexing procedures are standardised in ISO 7816.

This part of ISO7816 is important for card manufacturers. They are the ones that choose the materials and establish a process that embeds the integrated circuit into the card.

[Home] | [Services] | [Solutions] | [Knowledge Base] | [Search] | [Contact]

Copyright 1999-2017 Jacquinot Consulting, Inc.
All rights reserved. Legal disclaimer Last modified August 10, 2017